BS EN 62258-1-2005 半导体压模制品.第1部分:采购和使用要求
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【英文标准名称】:Semiconductordieproducts-Part1:Requirementsforprocurementanduse
【原文标准名称】:半导体压模制品.第1部分:采购和使用要求
【标准号】:BSEN62258-1-2005
【标准状态】:作废
【国别】:英国
【发布日期】:2006-03-07
【实施或试行日期】:2006-03-07
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:组件;芯片;元件;连接件;定义;交付;电气工程;电学测量;电子工程;电子设备及元件;环境测试;集成电路;材料;机械测试;采购;生产;半导体器件;半导体;规范(验收);测试;薄片
【英文主题词】:Assemblies;Chips;Components;Connections;Definition;Definitions;Delivery;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Environmentaltesting;Integratedcircuits;Materials;Mechanicaltesting;Procurements;Production;Semiconductordevices;Semiconductors;Specification(approval);Testing;Wafers
【摘要】:ThispartofIEC62258hasbeendevelopedtofacilitatetheproduction,supplyanduseofsemiconductordieproducts,including–wafers,–singulatedbaredie,–dieandwaferswithattachedconnectionstructures,–minimallyorpartiallyencapsulateddieandwafers.Thisstandarddefinestheminimumrequirementsforthedatawhichareneededtodescribesuchdieproductsandisintendedasanaidinthedesignofandprocurementofassembliesincorporatingdieproducts.Itcoverstherequirementsfordata,including–productidentity,–productdata,–diemechanicalinformation,–test,quality,assemblyandreliabilityinformation,–handling,shippingandstorageinformation.Thisstandardcoversthespecificrequirementsfordataneededtodescribethegeometricalpropertiesofdie,theirphysicalpropertiesandthemeansofconnectionnecessaryfortheiruseinthedevelopmentandmanufactureofproducts.Italsocontains,inAnnexesAandB,terminologyandalistofcommonacronyms,respectively.
【中国标准分类号】:L40
【国际标准分类号】:31_200
【页数】:42P.;A4
【正文语种】:英语
【原文标准名称】:半导体压模制品.第1部分:采购和使用要求
【标准号】:BSEN62258-1-2005
【标准状态】:作废
【国别】:英国
【发布日期】:2006-03-07
【实施或试行日期】:2006-03-07
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:组件;芯片;元件;连接件;定义;交付;电气工程;电学测量;电子工程;电子设备及元件;环境测试;集成电路;材料;机械测试;采购;生产;半导体器件;半导体;规范(验收);测试;薄片
【英文主题词】:Assemblies;Chips;Components;Connections;Definition;Definitions;Delivery;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Environmentaltesting;Integratedcircuits;Materials;Mechanicaltesting;Procurements;Production;Semiconductordevices;Semiconductors;Specification(approval);Testing;Wafers
【摘要】:ThispartofIEC62258hasbeendevelopedtofacilitatetheproduction,supplyanduseofsemiconductordieproducts,including–wafers,–singulatedbaredie,–dieandwaferswithattachedconnectionstructures,–minimallyorpartiallyencapsulateddieandwafers.Thisstandarddefinestheminimumrequirementsforthedatawhichareneededtodescribesuchdieproductsandisintendedasanaidinthedesignofandprocurementofassembliesincorporatingdieproducts.Itcoverstherequirementsfordata,including–productidentity,–productdata,–diemechanicalinformation,–test,quality,assemblyandreliabilityinformation,–handling,shippingandstorageinformation.Thisstandardcoversthespecificrequirementsfordataneededtodescribethegeometricalpropertiesofdie,theirphysicalpropertiesandthemeansofconnectionnecessaryfortheiruseinthedevelopmentandmanufactureofproducts.Italsocontains,inAnnexesAandB,terminologyandalistofcommonacronyms,respectively.
【中国标准分类号】:L40
【国际标准分类号】:31_200
【页数】:42P.;A4
【正文语种】:英语
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